LEDIiL® SOLDER-CLIP
Tepcomp is Active LEDiL EcoSystem-partner and has been involved in Industrialization of LEDiL Solder-Clip optics with pick and place machine (SMD/SMA).
Tepcomp team has made the prototype batches. Tepcomp NPI Team (New Product Industrialization) has given valuable DFM -feedback for LEDiL, which has been helping making the result satisfactory.
The result is easy, reliable and cost effective method of mounting optics to led module PCBA’s only using one process (SMA).
Contact person
Petri Haanpää
Account Director, Lighting
+358 40 502 8200
petri.haanpaa@tepcomp.fi